• For Use with Demanding High Density Electronic Assemblies
• Reduced Head-in-Pillow
• Extremely Stable Formula
• Extended Pause-to-Print Process Window
• Reduces Voiding on QFN Ground Pads
• Improved Printing Characteristics
• ROL0 per J-STD-004B
• REACH Compliant
ADHESIVES FILLERS & SEALANTS, SOLDERING
CHEMTOOLS Solder Paste Sn63/Pb37 No Clean 1Kg Cartridge
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